第三代半导体材料
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参考文献

[1]MARUSKA H P,TIETJEN J J.The preparation and properties of vapor-deposited single-crystalline GaN[J].Applied Physics Letters,1969,15(10):327-329.

[2]LEVINSHTEIN M E,RUMYANTSEV S L,SHUR M S.先进半导体材料性能与数据手册[M].杨树人,殷景志,译.北京:化学工业出版社,2003.

[3]ISHIDA M,UEDA T,TANAKA T,et al.GaN on Si technologies for power switching devices[J].IEEE Transactions on Electron Devices,2013,60(10):3053-3059.

[4]CHEN W,WONG K Y,CHEN K J.Single-chip boost converter using monolithically integrated AlGaN/GaN lateral field-effect rectifier and normally off HEMT[J].IEEE Electron Device Letters,2009,30(5):430-432.

[5]POWELL A R,ROWLAND L B.SiC materials-progress,status,and potential roadblocks[J].Proceedings of the IEEE,2002,90(6):942-955.

[6]NEUDECK P G,OKOJIE R S,CHEN L Y.High-temperature electronics:a role for wide bandgap semiconductors[J].Proceedings of the IEEE,2002,90(6):1065-1076.

[7]SERVICE R F.Will UV lasers beat the blues[J].Science,1997,276(5314):895-895.